TG-30 Thermal paste

Key Features

• High thermal conductivity of 17.5 W/m·K

• Pump-out resistant formula for long-lasting thermal contact

• Advanced oil-lock technology helps reduce oil separation

• Supports stable cooling during repeated thermal cycles

• Helps reduce the frequency of thermal paste replacement

• Suitable for high-performance laptop and desktop CPUs and GPUs

• Ideal for gaming PCs, workstations, and internet café systems

• Available in convenient 2 g and 4 g packages

• Suitable for PC upgrades, repairs, and routine maintenance
  
  

Typical Applications

• Gaming PC CPU and GPU cooling

• High-performance laptop maintenance

• Desktop computer upgrades

• Internet café computer maintenance

• Workstation thermal management

• CPU and GPU thermal paste replacement

• PC building and DIY cooling projects
  
  

Application Instructions

1. Turn off the computer and disconnect the power.

2. Remove the heat sink and clean away the old thermal compound.

3. Clean and dry the CPU or GPU surface.

4. Apply a small, even amount of TG-30 to the chip.

5. Reinstall the heat sink and ensure firm, even contact.

6. Reassemble the system before use.
   
   

Available Sizes

• TG-30 2 g Thermal Paste

• TG-30 4 g Thermal Paste