TG-30 2.2g Thermal Paste

Key Features

• High thermal conductivity of 17.5 W/m·K

• Designed for high-performance laptop CPUs and GPUs

• Helps fill microscopic gaps between chips and heat sinks

• Long-lasting performance with resistance to drying and degradation

• Supports stable heat dissipation under heavy workloads

• Reliable electrical insulation properties

• Helps reduce the risk of short circuits

• Compact 2.2 g package for replacement and maintenance

• Suitable for gaming laptops, notebooks, desktop PCs, and graphics cards
  
  

Typical Applications

• Gaming laptop CPU cooling

• Notebook CPU and GPU replacement

• Desktop CPU thermal maintenance

• Graphics card cooling

• PC performance upgrades

• Routine thermal paste replacement

• High-performance electronic devices
  
  

Application Instructions

1. Remove the old thermal paste and clean both contact surfaces.

2. Apply a small, even amount of TG-30 to the CPU or GPU surface.

3. Install the heat sink and allow it to spread the paste evenly.

4. Secure the heat sink firmly and ensure proper contact.
   
   

Product Specifications

• Product Model: TG-30

• Product Type: Thermal Paste / Thermal Compound

• Thermal Conductivity: 17.5 W/m·K

• Net Weight: 2.2 g

• Application: CPU, GPU, notebook, desktop PC, and graphics card cooling