TS-6 Thermal Pad
16 W/m·K Thermal Conductivity for Efficient Heat Dissipation
The Coxbyte TS-6 is a high-performance silicone thermal pad designed to improve heat transfer between electronic components and heat sinks. With thermal conductivity of up to 16 W/m·K, it provides an efficient and reliable thermal interface for demanding electronic applications.
The soft, electrically insulating silicone material conforms to uneven surfaces and helps fill interface gaps without the need for thermal grease or copper sheets. Simply remove the protective films from both sides and apply the pad directly to the target component.
Available in thicknesses from 0.5 mm to 3.0 mm, the TS-6 can be selected according to different gap requirements. It operates reliably from -50°C to +250°C, making it suitable for laptops, video memory, motherboards, SSDs, M.2 devices, ICs, and other electronic components requiring additional heat dissipation.









