TS8 Thermal Pad

Key Features

• Reliable heat transfer for electronic components

• Wide operating temperature range: -50°C to +250°C

• Hardness range: 30–55 Shore C

• Electrically non-conductive

• Non-toxic and designed for safe handling

• Soft and conformable for effective interface contact

• Suitable for VRAM, GDDR memory, motherboards, SSDs, M.2 drives, and ICs

• Easy-to-use thermal interface solution for various electronic devices
  
  

Typical Applications

• VRAM and GDDR memory cooling

• Motherboard component cooling

• SSD and M.2 thermal management

• Integrated circuit cooling

• Laptop and desktop computer maintenance

• Graphics card thermal pad replacement

• Electronic devices requiring electrical insulation and heat transfer
  
  

Installation Instructions

1. Turn off the device and disconnect the power.

2. Remove the old thermal pad and clean the contact surfaces.

3. Select the appropriate pad thickness for the interface gap.

4. Remove the protective film and place the pad evenly on the target component.

5. Install the heat sink and ensure sufficient contact pressure.

6. Avoid stretching or folding the thermal pad during installation.
   
   

Product Specifications

• Product Model: TS-8

• Product Type: Non-Conductive Thermal Pad

• Operating Temperature: -50°C to +250°C

• Hardness: 30–55 Shore C

• Electrical Property: Non-Conductive

• Safety Property: Non-Toxic

• Color: To be confirmed according to the actual product