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TPK-30
TPK-30 Phase Change Thermal Pad
High-Performance Phase Change Thermal Interface Material
TPK-30 is a high-performance phase change thermal pad designed for efficient heat dissipation and reliable thermal management. With an ultra-low thermal resistance of 0.04 °C·cm²/W, it helps improve heat transfer between heat-generating components and heat sinks.
The pad remains solid at room temperature, making it easy to store, handle, and install. When heated to its operating temperature, TPK-30 softens and flows to fill interface gaps, creating closer contact between the heat source and heat sink for enhanced thermal performance.
TPK-30 is ideal for CPU, GPU, MCU, power electronics, and other applications requiring efficient and stable thermal management.
High-Performance Phase Change Thermal Interface Material
TPK-30 is a high-performance phase change thermal pad designed for efficient heat dissipation and reliable thermal management. With an ultra-low thermal resistance of 0.04 °C·cm²/W, it helps improve heat transfer between heat-generating components and heat sinks.
The pad remains solid at room temperature, making it easy to store, handle, and install. When heated to its operating temperature, TPK-30 softens and flows to fill interface gaps, creating closer contact between the heat source and heat sink for enhanced thermal performance.
TPK-30 is ideal for CPU, GPU, MCU, power electronics, and other applications requiring efficient and stable thermal management.
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